一句话：提出 SMAPPIC——首个基于云 FPGA 的开源共享内存多 die 体系结构原型平台，降低大规模原型验证的成本与门槛。
基于 FPGA 的体系结构原型长期面临两个问题：超大 FPGA 价格高昂，多数个人与研究机构难以负担；FPGA 开发本身的学习与工程负担又加重了研究者（尤其是软件方向研究者）的负担。当设计规模超出单片 FPGA 容量时，这些问题进一步恶化。本文提出 SMAPPIC，这是首个面向共享内存多 die 体系结构、运行在云 FPGA 上的开源原型平台。SMAPPIC 复用 OpenPiton/BYOC 基础设施与 AWS F1 实例，使 SoC、处理器核、加速器、缓存子系统等的 FPGA 原型构建变得廉价、可扩展且易于使用。作者认为，SMAPPIC 支持许多在现有软件工具与 FPGA 工具中难以实现或实现起来极为复杂的用例，并有望加速计算机工程领域在近期的创新速度。
Traditionally, architecture prototypes are built on top of FPGA infrastructure, with two associated problems. First, very large FPGAs are prohibitively expensive for most people and institutions. Second, the burden of FPGA development adds to an already uneasy life of researchers, especially those who focus on software. Large designs that do not fit into a single FPGA exacerbate these issues even more. This work presents SMAPPIC — the first open-source prototype platform for shared memory multi-die architectures on cloud FPGAs. SMAPPIC leverages the OpenPiton/BYOC infrastructure and AWS F1 instances to make FPGA-based prototypes of System-on-Chips, processor cores, accelerators, cache subsystems, etc., cheap, scalable, and straightforward. SMAPPIC enables many use cases that are not possible or significantly more complicated in existing software and FPGA tools. This work has the potential to accelerate the rate of innovation in computer engineering fields in the nearest future.